公开(公告)号：US20200350259A1

公开(公告)日：2020-11-05

申请号：US16927805

申请日：2020-07-13

Applicant: ASML Netherlands B.V.

Inventor： Johannes Cornelis Jacobus De Langen ,  Marcel Nicolaas Jacobus van Kervinck ,  Vincent Sylvester Kuiper

IPC: H01L23/544 ,  G06K19/06 ,  G06F21/44 ,  G09C5/00 ,  G06F21/73 ,  H04L29/06 ,  G06K7/14 ,  H01L25/065 ,  H04L9/14 ,  H04L9/32

Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non--common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.

公开(公告)号：US11688694B2

公开(公告)日：2023-06-27

申请号：US16927805

申请日：2020-07-13

Applicant: ASML Netherlands B.V.

Inventor： Johannes Cornelis Jacobus De Langen ,  Marcel Nicolaas Jacobus van Kervinck ,  Vincent Sylvester Kuiper

IPC: H01L23/00 ,  H01L23/544 ,  G06K19/06 ,  G06F21/44 ,  G09C5/00 ,  G06F21/73 ,  H04L9/40 ,  G06K7/14 ,  H01L25/065 ,  H04L9/14 ,  H04L9/32

CPC classification number: H01L23/544 ,  G06F21/44 ,  G06F21/73 ,  G06K7/1417 ,  G06K19/06037 ,  G06K19/06178 ,  G09C5/00 ,  H01L25/0652 ,  H04L9/14 ,  H04L9/3271 ,  H04L63/08 ,  G06F2221/2103 ,  H01L2223/5444 ,  H01L2223/54413 ,  H01L2223/54433

Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.

公开(公告)号：US10714427B2

公开(公告)日：2020-07-14

申请号：US15444396

申请日：2017-02-28

Applicant: ASML Netherlands B.V.

Inventor： Johannes Cornelis Jacobus De Langen ,  Marcel Nicolaas Jacobus van Kervinck ,  Vincent Sylvester Kuiper

IPC: H01L23/00 ,  H01L23/544 ,  G06K19/06 ,  G06F21/44 ,  G09C5/00 ,  G06F21/73 ,  H04L29/06 ,  G06K7/14 ,  H01L25/065 ,  H04L9/14 ,  H04L9/32

Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.

公开(公告)号：US20200098697A1

公开(公告)日：2020-03-26

申请号：US16697033

申请日：2019-11-26

Applicant: ASML Netherlands B.V.

Inventor： Johannes Cornelis Jacobus De Langen ,  Marcel Nicolaas Jacobus van Kervinck ,  Vincent Sylvester Kuiper

IPC: H01L23/544 ,  G06K19/06 ,  G06F21/44 ,  G09C5/00 ,  G06F21/73 ,  H04L29/06 ,  G06K7/14 ,  H01L25/065 ,  H04L9/14 ,  H04L9/32

Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.

公开(公告)号：US10522472B2

公开(公告)日：2019-12-31

申请号：US15444369

申请日：2017-02-28

Applicant: ASML Netherlands B.V.

Inventor： Johannes Cornelis Jacobus De Langen ,  Marcel Nicolaas Jacobus van Kervinck ,  Vincent Sylvester Kuiper

IPC: H01L23/00 ,  H01L23/544 ,  H04L29/06 ,  G06K7/14 ,  G06K19/06 ,  H01L25/065 ,  H04L9/14 ,  H04L9/32 ,  G06F21/44 ,  G06F21/73 ,  G09C5/00

Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.

公开(公告)号：US20230369237A1

公开(公告)日：2023-11-16

申请号：US18318557

申请日：2023-05-16

Applicant: ASML Netherlands B.V.

Inventor： Johannes Cornelis Jacobus De Langen ,  Marcel Nicolaas Jacobus van Kervinck ,  Vincent Sylvester Kuiper

IPC: H01L23/544 ,  H04L9/14 ,  G06K19/06 ,  G09C5/00 ,  H04L9/32 ,  G06K7/14 ,  H01L25/065 ,  H04L9/40 ,  G06F21/73 ,  G06F21/44

CPC classification number: H01L23/544 ,  H04L9/14 ,  G06K19/06037 ,  G09C5/00 ,  H04L9/3271 ,  G06K7/1417 ,  H01L25/0652 ,  H04L63/08 ,  G06K19/06178 ,  G06F21/73 ,  G06F21/44 ,  H01L2223/54433 ,  H01L2223/54413 ,  H01L2223/5444 ,  G06F2221/2103

Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.

公开(公告)号：US11004800B2

公开(公告)日：2021-05-11

申请号：US16697033

申请日：2019-11-26

Applicant: ASML Netherlands B.V.

Inventor： Johannes Cornelis Jacobus De Langen ,  Marcel Nicolaas Jacobus van Kervinck ,  Vincent Sylvester Kuiper

IPC: H01L23/00 ,  H01L23/544 ,  G06K19/06 ,  G06F21/44 ,  G09C5/00 ,  G06F21/73 ,  H04L29/06 ,  G06K7/14 ,  H01L25/065 ,  H04L9/14 ,  H04L9/32

Abstract: An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.