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公开(公告)号:US09989858B2
公开(公告)日:2018-06-05
申请号:US15111457
申请日:2014-12-05
Applicant: ASML Netherlands B.V.
Inventor: Daan Maurits Slotboom , Pieter Jacob Kramer , Martinus Hendrikus Antonius Leenders , Bart Dinand Paarhuis
CPC classification number: G03F7/70141 , G03F9/7046 , G03F9/7096
Abstract: Disclosed is an apparatus and method for performing a measurement operation on a substrate in accordance with one or more substrate alignment models. The one or more substrate alignment models are selected from a plurality of candidate substrate alignment models. The apparatus, which may be a lithographic apparatus, includes an external interface which enables selection of the substrate alignment model(s) and/or alteration of the substrate alignment model(s) prior to the measurement operation.
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公开(公告)号:US10095131B2
公开(公告)日:2018-10-09
申请号:US15315885
申请日:2015-05-13
Applicant: ASML Netherlands B.V.
Abstract: A method including determining a position of a first pattern in each of a plurality of target portions on a substrate, based on a fitted mathematical model, wherein the first pattern includes at least one alignment mark, wherein the mathematical model is fitted to a plurality of alignment mark displacements (dx, dy) for the alignment marks in the target portions, and wherein the alignment mark displacements are a difference between a respective nominal position of the alignment mark and measured position of the alignment mark; and transferring a second pattern onto each of the target portions, using the determined position of the first pattern in each of the plurality of target portions, wherein the mathematical model includes polynomials Z1 and Z2: Z1=r2 cos(2θ) and Z2=r2 sin(2θ) in polar coordinates (r, θ) or Z1=x2−y2 and Z2=xy in Cartesian coordinates (x, y).
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公开(公告)号:US10444632B2
公开(公告)日:2019-10-15
申请号:US15994400
申请日:2018-05-31
Applicant: ASML Netherlands B.V.
Inventor: Daan Maurits Slotboom , Pieter Jacob Kramer , Martinus Hendrikus Antonius Leenders , Bart Dinand Paarhuis
Abstract: An apparatus and method for performing a measurement operation on a substrate in accordance with one or more substrate alignment models. The one or more substrate alignment models are selected from a plurality of candidate substrate alignment models. The apparatus, which may be a lithographic apparatus, includes an external interface which enables selection of the substrate alignment model(s) and/or alteration of the substrate alignment model(s) prior to the measurement operation.
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