公开(公告)号：US20210193437A1

公开(公告)日：2021-06-24

申请号：US17127956

申请日：2020-12-18

Applicant: ASML Netherlands B.V.

Inventor： Weiming REN ,  Zizhou GONG ,  Xuerang HU ,  Xuedong LIU ,  Zhong-wei CHEN

IPC: H01J37/317 ,  H01J37/28 ,  H01J37/244 ,  H01J37/141 ,  H01J37/20 ,  H01J37/147

Abstract: Systems and methods of forming images of a sample using a multi-beam apparatus are disclosed. The method may include generating a plurality of secondary electron beams from a plurality of probe spots on the sample upon interaction with a plurality of primary electron beams. The method may further include adjusting an orientation of the plurality of primary electron beams interacting with the sample, directing the plurality of secondary electron beams away from the plurality of primary electron beams, compensating astigmatism aberrations of the plurality of directed secondary electron beams, focusing the plurality of directed secondary electron beams onto a focus plane, detecting the plurality of focused secondary electron beams by a charged-particle detector, and positioning a detection plane of the charged-particle detector at or close to the focus plane.

公开(公告)号：US20240420916A1

公开(公告)日：2024-12-19

申请号：US18706592

申请日：2022-10-05

Applicant: ASML Netherlands B.V.

Inventor： Xiaoyu JI ,  Zizhou GONG ,  Weiming REN

IPC: H01J37/20

Abstract: An improved method of wafer inspection is disclosed. The improved method includes a non-transitory computer-readable medium storing a set of instructions that are executable by at least one processor of a device to cause the device to perform a method comprising: placing the wafer at a location on a stage; moving one or more movable segments of a conductive ring inward in a radial direction to enable the conductive ring to be within a predetermined distance from an edge of the wafer; and adjusting a voltage applied to the conductive ring or to a voltage applied to the wafer so that to enable the voltage applied to the conductive ring to be substantially equal to the voltage applied to the wafer to provide a substantially consistent electric field across an inner portion of the conductive ring and an outer portion of the wafer.