公开(公告)号：US20240359329A1

公开(公告)日：2024-10-31

申请号：US18139611

申请日：2023-04-26

Applicant: ASMPT Singapore Pte. Ltd.

Inventor： Wai Lam NG ,  Chi Piu WONG ,  Hon Keung LEE ,  Yuen Wai LEE ,  Yin Fun NG

IPC: B25J9/16 ,  B25J11/00 ,  B25J15/00 ,  B25J15/06

CPC classification number: B25J9/1679 ,  B25J11/005 ,  B25J15/0028 ,  B25J15/0033 ,  B25J15/0616

Abstract: A method of picking an electronic component from an adhesive tape on which the electronic component is mounted which includes selecting a electronic component from a plurality of electronic components arranged on the adhesive tape, each electronic component being located on the adhesive tape over an associated support upstanding from a support bed; displacing the adhesive tape towards the support bed to peel the adhesive tape from edges of the electronic component; and displacing a gripper to detach the electronic component from the adhesive tape.