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公开(公告)号:US20240359329A1
公开(公告)日:2024-10-31
申请号:US18139611
申请日:2023-04-26
Applicant: ASMPT Singapore Pte. Ltd.
Inventor: Wai Lam NG , Chi Piu WONG , Hon Keung LEE , Yuen Wai LEE , Yin Fun NG
CPC classification number: B25J9/1679 , B25J11/005 , B25J15/0028 , B25J15/0033 , B25J15/0616
Abstract: A method of picking an electronic component from an adhesive tape on which the electronic component is mounted which includes selecting a electronic component from a plurality of electronic components arranged on the adhesive tape, each electronic component being located on the adhesive tape over an associated support upstanding from a support bed; displacing the adhesive tape towards the support bed to peel the adhesive tape from edges of the electronic component; and displacing a gripper to detach the electronic component from the adhesive tape.