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公开(公告)号：US10952348B2
公开(公告)日：2021-03-16
申请号：US16429247
申请日：2019-06-03
Applicant: ASUSTeK COMPUTER INC.
Inventor： Chen-Hsuan Ma , Ching Ho , Yu-Chen Lee
Abstract: A heat dissipation device includes a housing and a fan. The housing includes a base and a plurality of fins. The fins are connected to the base and are arranged sequentially along a direction. The plurality of fins each have an opening, and the openings are communicated to form a space. The fan is disposed inside the space and is configured to rotate about an axis parallel to the direction.
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