公开(公告)号：US20250016964A1

公开(公告)日：2025-01-09

申请号：US18459425

申请日：2023-09-01

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yu-Wen Chung ,  Shun-Wei Yang ,  Heng-Yu Lee ,  Hao-Yuan Cheng ,  Chun-Shi Liu ,  Chia-Wei Chang

IPC: H05K7/20

Abstract: A node unit includes a base plate, at least one function module, and a non-conductive coolant. The function module includes a heat-generating element, a heat-dissipating structure, and a pump. The heat-generating element is disposed on the base plate, the heat-dissipating structure is disposed on the heat-generating element, and the pump is disposed on the heat-dissipating structure. The base plate and the at least one function module are immersed in the non-conductive coolant. The pump is configured to drive the non-conductive coolant to flow into the heat-dissipating structure and discharge from the heat-dissipating structure. An electronic device and an immersion cooling type equipment are also mentioned.

公开(公告)号：US20190373766A1

公开(公告)日：2019-12-05

申请号：US16423471

申请日：2019-05-28

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-Wei Chang

IPC: H05K7/20

Abstract: A circuit board and a heat dissipating device are provided. The heat dissipating device is for dissipating heat from a heat element. The heat dissipating device comprises: a base, having a plurality of fixing holes, each of the fixing holes is disposed adjacent to a periphery of the base, each connecting direction is respectively defined according to a connecting line between each of the fixing holes and the adjacent fixing holes; a fin set, disposed on the base and having at least one airflow channel; and a fan assembly, disposed in the fin set to generate an airflow flows through the at least one airflow channel, wherein a vertical projection of the direction of the at least one airflow channel on the base and a vertical projection of the connecting line direction on the base are non-orthogonal and non-parallel.

公开(公告)号：US10813247B2

公开(公告)日：2020-10-20

申请号：US16423471

申请日：2019-05-28

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chia-Wei Chang

IPC: H05K7/20

Abstract: A circuit board and a heat dissipating device are provided. The heat dissipating device is for dissipating heat from a heat element. The heat dissipating device comprises: a base, having a plurality of fixing holes, each of the fixing holes is disposed adjacent to a periphery of the base, each connecting direction is respectively defined according to a connecting line between each of the fixing holes and the adjacent fixing holes; a fin set, disposed on the base and having at least one airflow channel; and a fan assembly, disposed in the fin set to generate an airflow flows through the at least one airflow channel, wherein a vertical projection of the direction of the at least one airflow channel on the base and a vertical projection of the connecting line direction on the base are non-orthogonal and non-parallel.