公开(公告)号：US20250016964A1

公开(公告)日：2025-01-09

申请号：US18459425

申请日：2023-09-01

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yu-Wen Chung ,  Shun-Wei Yang ,  Heng-Yu Lee ,  Hao-Yuan Cheng ,  Chun-Shi Liu ,  Chia-Wei Chang

IPC: H05K7/20

Abstract: A node unit includes a base plate, at least one function module, and a non-conductive coolant. The function module includes a heat-generating element, a heat-dissipating structure, and a pump. The heat-generating element is disposed on the base plate, the heat-dissipating structure is disposed on the heat-generating element, and the pump is disposed on the heat-dissipating structure. The base plate and the at least one function module are immersed in the non-conductive coolant. The pump is configured to drive the non-conductive coolant to flow into the heat-dissipating structure and discharge from the heat-dissipating structure. An electronic device and an immersion cooling type equipment are also mentioned.