公开(公告)号：US20240128093A1

公开(公告)日：2024-04-18

申请号：US18073572

申请日：2022-12-02

Applicant: ASUSTeK COMPUTER INC.

Inventor： Xu Wang ,  Chih-Kuan Liu

IPC: H01L21/56 ,  H05K3/30

CPC classification number: H01L21/56 ,  H05K3/30 ,  H01L23/3736 ,  H05K2203/095

Abstract: A manufacturing method of an electronic device includes that a chip package is mounted on a circuit board. And an exposed surface of the chip package is bombarded with plasma to clean the surface. The manufacturing method of the electronic device of the application can effectively clean the chip package without reducing the reliability of the electronic device.

公开(公告)号：US20250063667A1

公开(公告)日：2025-02-20

申请号：US18757425

申请日：2024-06-27

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chih-Kuan Liu ,  Xu Wang

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/22

Abstract: An electronic assembly includes a substrate, a chip configured on the substrate, a cover component configured on the chip, a capacitance element configured on the substrate, and a sealing structure surrounding the chip and sealing a gap between the cover component and the substrate. The sealing structure includes an insulating gel encapsulating the capacitance element. In addition, a manufacturing method of the electronic assembly is also provided.