公开(公告)号：US12167553B2

公开(公告)日：2024-12-10

申请号：US17974497

申请日：2022-10-26

Applicant: ASUSTeK COMPUTER INC.

Inventor： Xu Wang ,  Hui He ,  Wei Tang ,  Jung-Kai Chang ,  Yuan-Yu Lin

IPC: H05K5/02

Abstract: A PCI-E expansion card module is configured to insert in a slot with a rotation switch. The PCI-E expansion card module includes a PCI-E expansion card body and an unlock mechanism. The PCI-E expansion card body includes an inserting portion and a positioning hook. The unlock mechanism is disposed beside the PCI-E expansion card body, and the unlock mechanism includes a pushing member. When the PCI-E expansion card body is inserted into the slot, the rotation switch is on a moving path of the pushing member. The pushing member moves and pushes the rotation switch to release a limitation of the PCI-E expansion card body.

公开(公告)号：US20240128093A1

公开(公告)日：2024-04-18

申请号：US18073572

申请日：2022-12-02

Applicant: ASUSTeK COMPUTER INC.

Inventor： Xu Wang ,  Chih-Kuan Liu

IPC: H01L21/56 ,  H05K3/30

CPC classification number: H01L21/56 ,  H05K3/30 ,  H01L23/3736 ,  H05K2203/095

Abstract: A manufacturing method of an electronic device includes that a chip package is mounted on a circuit board. And an exposed surface of the chip package is bombarded with plasma to clean the surface. The manufacturing method of the electronic device of the application can effectively clean the chip package without reducing the reliability of the electronic device.

公开(公告)号：US20250063667A1

公开(公告)日：2025-02-20

申请号：US18757425

申请日：2024-06-27

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chih-Kuan Liu ,  Xu Wang

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/22

Abstract: An electronic assembly includes a substrate, a chip configured on the substrate, a cover component configured on the chip, a capacitance element configured on the substrate, and a sealing structure surrounding the chip and sealing a gap between the cover component and the substrate. The sealing structure includes an insulating gel encapsulating the capacitance element. In addition, a manufacturing method of the electronic assembly is also provided.

公开(公告)号：US20240345637A1

公开(公告)日：2024-10-17

申请号：US18515214

申请日：2023-11-20

Applicant: ASUSTeK COMPUTER INC.

Inventor： Xu Wang ,  Chien-Lung Chang ,  Fangping Yuan ,  Liang Huang

IPC: G06F1/18 ,  H05K7/14

CPC classification number: G06F1/185

Abstract: An electronic device includes a circuit board assembly and an expansion card assembly. The circuit board assembly includes a circuit board body, a first circuit board connection port, a second circuit board connection port, and a third circuit board connection port. The expansion card assembly is adapted for plugging in the circuit board assembly, and includes an expansion card body, a first expansion card connection port, and a second expansion card connection port. When the expansion card assembly is plugged in the circuit board assembly, the first expansion card connection port is docked with the first circuit board connection port, the second expansion card connection port is docked with the second circuit board connection port, and the third circuit board connection port is electrically connected to the expansion card body through the second circuit board connection port and the second expansion card connection port.

公开(公告)号：US20230354534A1

公开(公告)日：2023-11-02

申请号：US17974497

申请日：2022-10-26

Applicant: ASUSTeK COMPUTER INC.

Inventor： Xu Wang ,  Hui He ,  Wei Tang ,  Jung-Kai Chang ,  Yuan-Yu Lin

IPC: H05K5/02

CPC classification number: H05K5/0221 ,  H05K5/0269

Abstract: A PCI-E expansion card module is configured to insert in a slot with a rotation switch. The PCI-E expansion card module includes a PCI-E expansion card body and an unlock mechanism. The PCI-E expansion card body includes an inserting portion and a positioning hook. The unlock mechanism is disposed beside the PCI-E expansion card body, and the unlock mechanism includes a pushing member. When the PCI-E expansion card body is inserted into the slot, the rotation switch is on a moving path of the pushing member. The pushing member moves and pushes the rotation switch to release a limitation of the PCI-E expansion card body.

公开(公告)号：US11409339B2

公开(公告)日：2022-08-09

申请号：US17030447

申请日：2020-09-24

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chien-Lung Chang ,  Xu Wang ,  Hui He

IPC: G06F1/20 ,  H05K5/02

Abstract: A fan module is provided in this disclosure. The fan module comprises a fan and a casing. The casing accommodates the fan and includes a first cover and at least one second cover, the second cover is rotatably connected with the first cover at a first location or a second location. A portion of the fan exposed by the second cover at the first location is less than that at the second location.