公开(公告)号：US20170332504A1

公开(公告)日：2017-11-16

申请号：US15481451

申请日：2017-04-06

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yao-Hsun HUANG ,  Yu-Chen LEE ,  Shu-Fen HUANG ,  I-Cheng YEH ,  Jonathan CHU ,  Ming-Hung CHUNG

IPC: H05K7/14 ,  G06F1/20 ,  H05K1/02 ,  H05K7/20

CPC classification number: G06F1/185

Abstract: An input/output module baffle is adapted to an electronic device. The electronic device includes a motherboard and a casing. The motherboard is located inside the casing and includes a connector module. The input/output module baffle includes a fixing plate, a conductive component and a frame. The fixing plate includes a plurality of retaining clips to clamp the fixing plate on the connector module. The conductive component is located between the fixing plate and the connector module. The frame is located between the fixing plate and the casing. Moreover, a motherboard with the input/output module baffle is also disclosed herein.