公开(公告)号：US20200274274A1

公开(公告)日：2020-08-27

申请号：US16794597

申请日：2020-02-19

Applicant: ASUSTEK COMPUTER INC.

Inventor： Ping-Han TSOU ,  Li-Chien WAN

IPC: H01R12/73 ,  H01R13/10 ,  H01R12/70 ,  H01R13/6474

Abstract: A memory slot adapted to dispose on a circuit board is provided. The memory slot includes a slot body and a plurality of pins. The slot body includes N connecting parts for configuring to M memory cards. The plurality of pins are disposed in the slot body for electrically connecting the M memory cards to the circuit board. Each pin includes O branches extending to the connecting parts respectively for electrically connecting corresponding golden fingers of the memory cards. Where the N, M and O are greater than or equal to 2. The disclosure further provides a main board with the memory slot.

公开(公告)号：US20230031184A1

公开(公告)日：2023-02-02

申请号：US17592126

申请日：2022-02-03

Applicant: ASUSTEK COMPUTER INC.

Inventor： Ping-Han TSOU ,  Li-Chien WAN

IPC: H05K1/09 ,  H05K1/02

Abstract: A printed circuit board is provided. The printed circuit board includes a substrate, an electrically conductive pattern layer, and a thermally conductive ink layer. The substrate includes a first surface. The electrically conductive pattern layer is located on the first surface and includes a contact portion and a wire portion. The thermally conductive ink layer covers the wire portion and exposes the contact portion. The thermally conductive ink layer includes a thermally conductive powder and a colloidal adhesive, where a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%. An electronic device including the printed circuit board is further provided.

公开(公告)号：US20200375021A1

公开(公告)日：2020-11-26

申请号：US16876981

申请日：2020-05-18

Applicant: ASUSTEK COMPUTER INC.

Inventor： Ping-Han TSOU ,  Li-Chien WAN

IPC: H05K1/02 ,  H05K1/18

Abstract: A printed circuit board comprising a main body, a first insulation layer, and an anti-electromagnetic interference (EMI) coating is provided. The first insulation layer covers the main body and comprises a predetermined area. The anti-EMI coating covers the predetermined area, and comprises wave-absorption powders and an adhesive material. A motherboard with the printed circuit board is also provided.

公开(公告)号：US20200015350A1

公开(公告)日：2020-01-09

申请号：US16443980

申请日：2019-06-18

Applicant: ASUSTeK COMPUTER INC.

Inventor： Ping-Han TSOU ,  Li-Chien WAN

IPC: H05K1/02 ,  H05K9/00

Abstract: An anti-electromagnetic interference circuit board includes a circuit board and a magnetic conductor. The circuit board has a plurality of vias, and the magnetic conductor is covered on the circuit board to cover some of the vias. The magnetic conductor includes a plate, a carrier, a sprayed magnetic conductor, and a wave absorbing magnetic conductor.

公开(公告)号：US20190042531A1

公开(公告)日：2019-02-07

申请号：US16054134

申请日：2018-08-03

Applicant: ASUSTEK COMPUTER INC.

Inventor： Li-Chien WAN

IPC: G06F15/78 ,  H05K1/14

Abstract: A motherboard includes a multilayer printed circuit board (PCB), a central processing unit (CPU) slot, at least one first memory slot, at least one second memory slot, a plurality of first traces, and a plurality of second traces. The CPU slot, the first memory slot, and the second memory slot are disposed on the first wiring layer of the multilayer PCB, and the second memory slot is disposed between the first memory slot and the CPU slot. The first traces are disposed on the first wiring layer of the multilayer PCB. The CPU slot is electrically connected to the first memory slot by the first traces. The second traces are disposed on the second wiring layer of the multilayer PCB which is different from the first wiring layer, and the CPU slot is electrically connected with the second memory slot by the second traces.