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公开(公告)号：US20200274274A1
公开(公告)日：2020-08-27
申请号：US16794597
申请日：2020-02-19
Applicant: ASUSTEK COMPUTER INC.
Inventor： Ping-Han TSOU , Li-Chien WAN
IPC: H01R12/73 , H01R13/10 , H01R12/70 , H01R13/6474
Abstract: A memory slot adapted to dispose on a circuit board is provided. The memory slot includes a slot body and a plurality of pins. The slot body includes N connecting parts for configuring to M memory cards. The plurality of pins are disposed in the slot body for electrically connecting the M memory cards to the circuit board. Each pin includes O branches extending to the connecting parts respectively for electrically connecting corresponding golden fingers of the memory cards. Where the N, M and O are greater than or equal to 2. The disclosure further provides a main board with the memory slot.
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公开(公告)号：US20230031184A1
公开(公告)日：2023-02-02
申请号：US17592126
申请日：2022-02-03
Applicant: ASUSTEK COMPUTER INC.
Inventor： Ping-Han TSOU , Li-Chien WAN
Abstract: A printed circuit board is provided. The printed circuit board includes a substrate, an electrically conductive pattern layer, and a thermally conductive ink layer. The substrate includes a first surface. The electrically conductive pattern layer is located on the first surface and includes a contact portion and a wire portion. The thermally conductive ink layer covers the wire portion and exposes the contact portion. The thermally conductive ink layer includes a thermally conductive powder and a colloidal adhesive, where a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%. An electronic device including the printed circuit board is further provided.
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公开(公告)号：US20200375021A1
公开(公告)日：2020-11-26
申请号：US16876981
申请日：2020-05-18
Applicant: ASUSTEK COMPUTER INC.
Inventor： Ping-Han TSOU , Li-Chien WAN
Abstract: A printed circuit board comprising a main body, a first insulation layer, and an anti-electromagnetic interference (EMI) coating is provided. The first insulation layer covers the main body and comprises a predetermined area. The anti-EMI coating covers the predetermined area, and comprises wave-absorption powders and an adhesive material. A motherboard with the printed circuit board is also provided.
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公开(公告)号：US20200015350A1
公开(公告)日：2020-01-09
申请号：US16443980
申请日：2019-06-18
Applicant: ASUSTeK COMPUTER INC.
Inventor： Ping-Han TSOU , Li-Chien WAN
Abstract: An anti-electromagnetic interference circuit board includes a circuit board and a magnetic conductor. The circuit board has a plurality of vias, and the magnetic conductor is covered on the circuit board to cover some of the vias. The magnetic conductor includes a plate, a carrier, a sprayed magnetic conductor, and a wave absorbing magnetic conductor.
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