公开(公告)号：US12189442B2

公开(公告)日：2025-01-07

申请号：US17725570

申请日：2022-04-21

Applicant: ASUSTeK COMPUTER INC.

Inventor： Kun-Hsin Chiang ,  Yu-Chieh Chang ,  Tang-Hui Liao ,  Wei-Hsian Chang ,  Wen-Yen Hsieh ,  Chih-Wei Kuo ,  Ming-Yi Huang ,  Ching-Chan Chu ,  Shun-Po Chang

IPC: G06F1/20 ,  G06F1/28 ,  H05K7/20

Abstract: A method for detecting heat dissipation is provided, including the following steps: sensing a core temperature of a heat emitting component of an electronic device; sensing current power of the heat emitting component when the core temperature is greater than or equal to a warning temperature; and transmitting an assembling check prompt and activating a thermal control circuit (TCC) when the current power is less than thermal design power (TDP) of the heat emitting component. An electronic device is further provided, to execute the method for detecting heat dissipation.

公开(公告)号：US20220350384A1

公开(公告)日：2022-11-03

申请号：US17725570

申请日：2022-04-21

Applicant: ASUSTeK COMPUTER INC.

Inventor： Kun-Hsin Chiang ,  Yu-Chieh Chang ,  Tang-Hui Liao ,  Wei-Hsian Chang ,  Wen-Yen Hsieh ,  Chih-Wei Kuo ,  Ming-Yi Huang ,  Ching-Chan Chu ,  Shun-Po Chang

IPC: G06F1/20 ,  H05K7/20 ,  G06F1/28

Abstract: A method for detecting heat dissipation is provided, including the following steps: sensing a core temperature of a heat emitting component of an electronic device; sensing current power of the heat emitting component when the core temperature is greater than or equal to a warning temperature; and transmitting an assembling check prompt and activating a thermal control circuit (TCC) when the current power is less than thermal design power (TDP) of the heat emitting component. An electronic device is further provided, to execute the method for detecting heat dissipation.