公开(公告)号：US11243411B2

公开(公告)日：2022-02-08

申请号：US16713088

申请日：2019-12-13

Applicant: ASUSTeK COMPUTER INC.

Inventor： Xian Zhong ,  Wen-Chang Hung

IPC: G02B30/56

Abstract: A 3D display system includes a rotational base, a 3D projecting device, an image capturing device, and a controller. The 3D projecting device is rotatably disposed on the rotational base. The image capturing device is disposed on the 3D projecting device. The controller is electrically connected to the image capturing device, the rotational base, and the 3D projecting device.

公开(公告)号：US11797060B2

公开(公告)日：2023-10-24

申请号：US17328848

申请日：2021-05-24

Applicant: ASUSTeK COMPUTER INC.

Inventor： Xian Zhong ,  Shih-Wei Chiu

IPC: G06F1/16 ,  G06F1/20

CPC classification number: G06F1/1681 ,  G06F1/203

Abstract: An electronic device is provided, which includes a first body, a second body, and a pivot structure connecting the first body and the second body. The pivot structure includes a shaft with an axis, a first assembling element assembled with the shaft and connected with the first body and a second assembling element pivotally connected to the shaft and connected with the second body. The second assembling element includes an abutting portion. When at the first position, the abutting portion and the first assembling element are located on the same side relative to the axis. When at the second position, the abutting portion rotates around the axis and is located on a different side relative to the axis, and the abutting portion abuts the abutting surface to generate an abutting force. Then the first body rises and an angle relative to the abutting surface is generated.

公开(公告)号：US11302574B2

公开(公告)日：2022-04-12

申请号：US16713076

申请日：2019-12-13

Applicant: ASUSTeK COMPUTER INC.

Inventor： Wen-Chang Hung ,  Xian Zhong

IPC: H01L21/786 ,  H01L27/12 ,  H01L27/32 ,  H01L21/768

Abstract: A method of manufacturing a display device comprises: forming a thin film transistor array on a substrate, wherein the substrate has a via which enable two opposite sides of the substrate to be communicated with each other; and filling the via with a conductive filler after the thin film transistor array is formed, so that the conductive filler is electrically connected with the thin film transistor array.