公开(公告)号：US09036348B2

公开(公告)日：2015-05-19

申请号：US13656087

申请日：2012-10-19

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yung-Ching Huang

IPC: H05K7/20 ,  G06F1/20 ,  F04D29/54

CPC classification number: G06F1/20

Abstract: A heat dissipating module includes a housing, a first fan and a second fan. The housing has a partition. The first fan is disposed at a side of the partition, and the second fan is disposed at the other side of the partition. The second fan has a plurality of wind deflectors, which are disposed higher than the partition.

Abstract translation: 散热模块包括壳体，第一风扇和第二风扇。 外壳有一个隔板。 第一风扇设置在隔板的一侧，第二风扇设置在隔板的另一侧。 第二风扇具有多个挡风板，其布置成高于隔板。

公开(公告)号：US20180294207A1

公开(公告)日：2018-10-11

申请号：US15935131

申请日：2018-03-26

Applicant: ASUSTeK COMPUTER INC.

Inventor： Yung-Ching Huang

IPC: H01L23/427 ,  H05K7/20

Abstract: A heat spreader includes a first metal cover, a second metal cover, a receiving cavity, a heat conducting block, and working fluid. The receiving cavity is formed between the first metal cover and the second metal cover, the working fluid is filled in the receiving cavity. The heat conducting block is disposed in the receiving cavity and contacted with the first metal cover and the second metal cover. The heat conducting block is corresponding to a heat source contacting area of the second metal cover. A contacting area between the heat conducting block and the second metal cover is larger than the area of the heat source contacting zone of the second metal cover.

公开(公告)号：USD725257S1

公开(公告)日：2015-03-24

申请号：US29480630

申请日：2014-01-28

Applicant: ASUSTeK Computer Inc.

Designer： Yung-Ching Huang ,  Kuo-Hsun Huang ,  Hsi-Feng Lin ,  Shih-Chieh Lin