专利检索 ap:("AT&S Austria Technologie & Systemtechnik Aktiengesellschaft") AND inv:"Walter Pessl" 第 1 页

1.

发明授权
Cooling component carrier material by carbon structure within dielectric shell 有权

公开(公告)号：US10736222B2

公开(公告)日：2020-08-04

申请号：US16313924

申请日：2017-06-29

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Jonathan Silvano de Sousa , Markus Leitgeb , Walter Pessl

IPC分类号： H05K1/02 , H05K3/00 , H05K3/46 , H05K1/18

摘要： A component carrier includes component carrier material and a heat spreading module with a carbon structure enclosed within a dielectric shell for disabling contact between the carbon structure and the component carrier material.

2.

发明申请
Cooling Component Carrier Material by Carbon Structure Within Dielectric Shell 审中-公开

公开(公告)号：US20190174638A1

公开(公告)日：2019-06-06

申请号：US16313924

申请日：2017-06-29

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Jonathan Silvano de Sousa , Markus Leitgeb , Walter Pessl

IPC分类号： H05K3/46 , H05K1/02

摘要： A component carrier includes component carrier material and a heat spreading module with a carbon structure enclosed within a dielectric shell for disabling contact between the carbon structure and the component carrier material.