公开(公告)号：US11798896B2

公开(公告)日：2023-10-24

申请号：US17344086

申请日：2021-06-10

Applicant: AVX Corporation

Inventor： Yehuda Seidman ,  Elinor O'Neill ,  Dan Rozbroj

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/768 ,  H01L23/64

CPC classification number: H01L23/562 ,  H01L21/76853 ,  H01L23/49805 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/64

Abstract: A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.

公开(公告)号：US20210305176A1

公开(公告)日：2021-09-30

申请号：US17344086

申请日：2021-06-10

Applicant: AVX Corporation

Inventor： Yehuda Seidman ,  Elinor O'Neill ,  Dan Rozbroj

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/768 ,  H01L23/64

Abstract: A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.

公开(公告)号：US11056444B2

公开(公告)日：2021-07-06

申请号：US16655280

申请日：2019-10-17

Applicant: AVX Corporation

Inventor： Yehuda Seidman ,  Elinor O'Neill ,  Dan Rozbroj

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/64 ,  H01L21/768

Abstract: A surface-mountable component is disclosed. The surface-mountable component may include a substrate having a side surface and a top surface that is perpendicular to the side surface. The component may include an element layer formed on the top surface of the substrate. The element layer may include a thin-film element and a contact pad electrically connected with the thin-film element. The contact pad may extend to the side surface of the substrate. The component may include a terminal that is electrically connected with the contact pad at a connection area. The connection area may be parallel with the top surface of the substrate. The terminal may have a visible edge surface that is approximately aligned with the side surface of the substrate. The visible edge surface may be visible for inspection when the surface-mountable component is mounted to a mounting surface.

公开(公告)号：US20200352026A1

公开(公告)日：2020-11-05

申请号：US16850160

申请日：2020-04-16

Applicant: AVX Corporation

Inventor： Dan Rozbroj ,  Yehuda Seidman ,  Elinor O'Neill

IPC: H05K1/02 ,  H01H69/02 ,  H01L23/525 ,  H01H85/041

Abstract: A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.