公开(公告)号：US20250167192A1

公开(公告)日：2025-05-22

申请号：US18518184

申请日：2023-11-22

Applicant: Advanced Micro Devices, Inc.

Inventor： Arsalan ALAM ,  Chandra Sekhar MANDALAPU ,  Liwei WANG ,  Omkar Deepak GUPTE ,  Anadi SRIVASTAVA ,  Sai VADLAMANI ,  Sri Ranga Sai BOYAPATI ,  Manish DUBEY

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: Disclosed herein is an integrated circuit die stack and an integrated circuit die package assembly having the integrated circuit die stack. The integrated circuit die stack includes first plurality of integrated circuit dice disposed in a first tier of the die stack, and the first plurality of integrated circuit dice include a first integrated circuit die and a bridge die. The integrated circuit die stack further includes a second plurality of integrated circuit dice disposed in a second tier of the die stack, and the second plurality of integrated circuit dice are stacked vertically above the first plurality of the integrated circuit dice of the first tier and include a second integrated circuit die and a third integrated circuit die. The bridge die couples with both the second integrated circuit die and the third integrated circuit die.