公开(公告)号：US20250008698A1

公开(公告)日：2025-01-02

申请号：US18345917

申请日：2023-06-30

Applicant: Advanced Micro Devices, Inc.

Inventor： Girish Anant Kini ,  Ahmed Mohamed Abou-Alfotouh ,  Shardul Suresh Adkar ,  Ethan Cruz ,  Salvador D. Jimenez, III ,  Mark Steinke ,  Edgar Stone

IPC: H05K7/20

Abstract: A method for server level cooling can include providing a printed circuit board and attaching a cooling system to the printed circuit board. The cooling system can be configured for placement thereon of two or more expansion cards having back side power delivery components. Various other methods, systems, and computer-readable media are also disclosed.

公开(公告)号：US20250107045A1

公开(公告)日：2025-03-27

申请号：US18471888

申请日：2023-09-21

Applicant: Advanced Micro Devices, Inc.

Inventor： Girish Anant Kini ,  Shardul Suresh Adkar ,  Salvador D. Jimenez, III ,  Mark Steinke ,  Ethan Cruz ,  Edgar Stone ,  Ahmed Mohamed Abou-Alfotouh

IPC: H05K7/20

Abstract: A method for cooling accelerators having back side power delivery components can include providing a printed circuit board having a first side that includes an integrated circuit and a first set of one or more power delivery components and a second side that is opposite the first side and that includes a second set of one or more power delivery components. The method can also include positioning a first cooling system to cool the integrated circuit and the first set of one or more power delivery components. The method can further include positioning a second cooling system to cool the second set of one or more power delivery components. Various other methods and systems are also disclosed.