公开(公告)号：US20220206916A1

公开(公告)日：2022-06-30

申请号：US17135466

申请日：2020-12-28

Applicant: Advanced Micro Devices, Inc.

Inventor： KARTHIK RAO ,  LEONARDO DE PAULA ROSA PIGA

IPC: G06F11/30 ,  G06F11/07 ,  G06F11/20 ,  G06F3/06

Abstract: Methods and apparatus manage data in memories disposed in a stacked relation with respect to one or more processors. The method includes receiving at least one hint indicating future processor usage of a software component, where the future processor usage is indicative of future usage of the one or more processors when executing the software component or a code section of the software component. In some implementations, the method includes selecting a memory location in the memories for data used by the software component based on the hint.

公开(公告)号：US20220107849A1

公开(公告)日：2022-04-07

申请号：US17519290

申请日：2021-11-04

Applicant: Advanced Micro Devices, Inc.

Inventor： KARTHIK RAO ,  SHOMIT N. DAS ,  XUDONG AN ,  WEI HUANG

IPC: G06F9/50 ,  G06F9/48 ,  G06F9/38 ,  H04L67/12

Abstract: In some examples, thermal aware optimization logic determines a characteristic (e.g., a workload or type) of a wavefront (e.g., multiple threads). For example, the characteristic indicates whether the wavefront is compute intensive, memory intensive, mixed, and/or another type of wavefront. The thermal aware optimization logic determines temperature information for one or more compute units (CUs) in one or more processing cores. The temperature information includes predictive thermal information indicating expected temperatures corresponding to the one or more CUs and historical thermal information indicating current or past thermal temperatures of at least a portion of a graphics processing unit (GPU). The logic selects the one or more compute units to process the plurality of threads based on the determined characteristic and the temperature information. The logic provides instructions to the selected subset of the plurality of CUs to execute the wavefront.