公开(公告)号：US20190181087A1

公开(公告)日：2019-06-13

申请号：US15836239

申请日：2017-12-08

Applicant: Advanced Micro Devices, Inc.

Inventor： Sanjay Dandia ,  Gerald R. Talbot ,  Mahesh S. Hardikar

IPC: H01L23/522 ,  H01L23/528 ,  H01L23/00

Abstract: An integrated circuit assembly includes an integrated circuit package substrate and a conductive land pad disposed on a surface of the integrated circuit package substrate. The conductive land pad comprises a conductor portion, an isolated conductor portion, and an isolation portion disposed between the conductor portion and the isolated conductor portion. The isolated conductor portion may surround a first side of the conductor portion and a second side of the conductor portion. The isolated conductor portion may surround a portion of a perimeter of the conductor portion. The isolation portion may include a gap between the conductor portion and the isolated conductor portion. The gap may have a width smaller than a radius of an interconnect structure of a receiving structure.