公开(公告)号：US20190034572A1

公开(公告)日：2019-01-31

申请号：US15663132

申请日：2017-07-28

Applicant: Advanced Micro Devices, Inc.

Inventor： Keith Kasprak ,  Patrick W. Shaw

IPC: G06F17/50 ,  H01L27/02

Abstract: Systems, apparatuses, and methods for efficiently floor planning a semiconductor chip are disclosed. Within either the processor or the memory of a computing system, each of a first block and a neighboring second block has a same height. A first metal track plan for the first block is unaligned with respect to a second metal track plan for the second block. An offset for moving each track of the second metal plan to align with a track of the first metal track plan is determined where the offset is a fraction of the height. The placement of the second block is shifted by the offset with respect to the first block. The shifted placement of the second block allows the first metal track plan for the first block to use a unidirectional pattern across the first block and the second block.

公开(公告)号：US10747931B2

公开(公告)日：2020-08-18

申请号：US15663132

申请日：2017-07-28

Applicant: Advanced Micro Devices, Inc.

Inventor： Keith Kasprak ,  Patrick W. Shaw

IPC: G06F30/392 ,  H01L27/02 ,  G06F30/394 ,  G06F30/398 ,  H01L27/11

Abstract: Systems, apparatuses, and methods for efficiently floor planning a semiconductor chip are disclosed. Within either the processor or the memory of a computing system, each of a first block and a neighboring second block has a same height. A first metal track plan for the first block is unaligned with respect to a second metal track plan for the second block. An offset for moving each track of the second metal plan to align with a track of the first metal track plan is determined where the offset is a fraction of the height. The placement of the second block is shifted by the offset with respect to the first block. The shifted placement of the second block allows the first metal track plan for the first block to use a unidirectional pattern across the first block and the second block.