公开(公告)号：US10566279B2

公开(公告)日：2020-02-18

申请号：US15880377

申请日：2018-01-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long Lu ,  Jen-Kuang Fang ,  Min Lung Huang ,  Chan Wen Liu ,  Ching Kuo Hsu

IPC: H01L23/31 ,  H01L23/522 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

Abstract: A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.