公开(公告)号：US20190055118A1

公开(公告)日：2019-02-21

申请号：US15680056

申请日：2017-08-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Hua CHEN ,  Cheng-Yuan KUNG ,  Che-Hau HUANG ,  Chin-Cheng KUO

IPC: B81B7/00 ,  B81C1/00

Abstract: A Micro Electro-Mechanical System (MEMS) device package includes a first circuit layer, a partition wall, a MEMS component, a second circuit layer and a polymeric dielectric layer. The partition wall is disposed over the first circuit layer. The MEMS component is disposed over the partition wall and electrically connected to the first circuit layer. The first circuit layer, the partition wall and the MEMS component enclose a space. The second circuit layer is disposed over and electrically connected to the first circuit layer. The polymeric dielectric layer is disposed between the first circuit layer and the second circuit layer.