公开(公告)号：US20210159156A1

公开(公告)日：2021-05-27

申请号：US16691296

申请日：2019-11-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Nan FANG ,  Chun-Jun ZHUANG ,  Chen Yuan WENG

IPC: H01L23/498 ,  H01L23/544 ,  H01L23/528

Abstract: A device structure includes a first electronic structure and a plurality of first electric contacts. The first electronic structure has a surface and a center. The first electric contacts are exposed from the surface. The first electric contacts are spaced by a pitch that increases with increasing distance from the center.

公开(公告)号：US20210134692A1

公开(公告)日：2021-05-06

申请号：US16671988

申请日：2019-11-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Nan FANG ,  Chien-Ching CHEN ,  Chen Yuan WENG

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L21/56

Abstract: A semiconductor package includes a semiconductor die having a first surface and a second surface opposite to the first surface, a conductive wiring layer stacked with the semiconductor die and proximal to the first surface, an encapsulant encapsulating the semiconductor die and stacked with the conductive wiring layer, and a replacement structure exposing from the encapsulant and being free of fillers. A method for manufacturing the semiconductor package is also disclosed in the present disclosure.