公开(公告)号：US20250070075A1

公开(公告)日：2025-02-27

申请号：US18237880

申请日：2023-08-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi-Yang CHIANG ,  Man-Wen TSENG ,  Chien-Ching CHEN

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: A package structure includes a wiring structure, a first electronic device and a reinforcement structure. The first electronic device is disposed over the top surface of the wiring structure, and has a bottom surface facing the top surface of the wiring structure. The first electronic device includes a plurality of first wires. The reinforcement structure is disposed over the top surface of the wiring structure, and includes a plurality of second wires directly contacting the plurality of first wires to reduce a variation of an elevation of the bottom surface of the first electronic device with respect to the top surface of the wiring structure.