公开(公告)号：US10312198B2

公开(公告)日：2019-06-04

申请号：US15789858

申请日：2017-10-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-Lun Yang ,  Yu-Shun Hsieh ,  Chia Yi Cheng ,  Hong Jie Chen ,  Shih Yu Huang

IPC: H01L23/52 ,  H01L23/552 ,  H01L23/495

Abstract: A semiconductor device package includes a lead frame, an electronic component, a package body, at least one conductive via and a conductive layer. The lead frame includes a paddle, a connection element and a plurality of leads. The electronic component is disposed on the paddle. The package body encapsulates the electronic component and the lead frame. The at least one conductive via is disposed in the package body, electrically connected to the connection element, and exposed from the package body. The conductive layer is disposed on the package body and the conductive via.

公开(公告)号：US10797004B2

公开(公告)日：2020-10-06

申请号：US16421238

申请日：2019-05-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-Lun Yang ,  Yu-Shun Hsieh ,  Chia Yi Cheng ,  Hong Jie Chen ,  Shih Yu Huang

IPC: H01L23/552 ,  H01L23/495

Abstract: A semiconductor device package includes: (1) a lead frame including a connection element and multiple leads; (2) a package body encapsulating the lead frame, wherein the package body includes a lower surface and an upper surface opposite to the lower surface, the package body includes a cavity exposing at least one of the leads; (3) at least one conductive via disposed in the cavity of the package body, electrically connected to the connection element, and exposed from the upper surface of the package body; and (4) a conductive layer disposed on the upper surface of the package body and the conductive via.