公开(公告)号：US10312198B2

公开(公告)日：2019-06-04

申请号：US15789858

申请日：2017-10-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-Lun Yang ,  Yu-Shun Hsieh ,  Chia Yi Cheng ,  Hong Jie Chen ,  Shih Yu Huang

IPC: H01L23/52 ,  H01L23/552 ,  H01L23/495

Abstract: A semiconductor device package includes a lead frame, an electronic component, a package body, at least one conductive via and a conductive layer. The lead frame includes a paddle, a connection element and a plurality of leads. The electronic component is disposed on the paddle. The package body encapsulates the electronic component and the lead frame. The at least one conductive via is disposed in the package body, electrically connected to the connection element, and exposed from the package body. The conductive layer is disposed on the package body and the conductive via.

公开(公告)号：US11450596B2

公开(公告)日：2022-09-20

申请号：US16693193

申请日：2019-11-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Cheng Hsu ,  Chih-Hung Hsu ,  Mei-Lin Hsieh ,  Yuan-Chun Chen ,  Yu-Shun Hsieh ,  Ko-Pu Wu ,  Chin Li Huang

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.

公开(公告)号：US11462467B2

公开(公告)日：2022-10-04

申请号：US16929018

申请日：2020-07-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Hsiu Huang ,  Chun Chen Chen ,  Wei Chih Cho ,  Shao-Lun Yang ,  Yu-Shun Hsieh

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00 ,  H01L23/495

Abstract: A lead frame includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion and an outer lead portion connecting to the inner lead portion. The inner lead portion is adjacent to and spaced apart from the die paddle. A bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion. The bottom surface of the inner lead portion includes one or more supporting members disposed thereon. The one or more supporting members have a convex surface facing away from the inner lead portion.

公开(公告)号：US11139225B2

公开(公告)日：2021-10-05

申请号：US16442286

申请日：2019-06-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuang-Hsiung Chen ,  Chih-Hung Hsu ,  Mei-Lin Hsieh ,  Yi-Cheng Hsu ,  Yuan-Chun Chen ,  Yu-Shun Hsieh ,  Ko-Pu Wu

IPC: H01L23/49 ,  H01L23/495 ,  H01L23/498

Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.

公开(公告)号：US10797004B2

公开(公告)日：2020-10-06

申请号：US16421238

申请日：2019-05-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-Lun Yang ,  Yu-Shun Hsieh ,  Chia Yi Cheng ,  Hong Jie Chen ,  Shih Yu Huang

IPC: H01L23/552 ,  H01L23/495

Abstract: A semiconductor device package includes: (1) a lead frame including a connection element and multiple leads; (2) a package body encapsulating the lead frame, wherein the package body includes a lower surface and an upper surface opposite to the lower surface, the package body includes a cavity exposing at least one of the leads; (3) at least one conductive via disposed in the cavity of the package body, electrically connected to the connection element, and exposed from the upper surface of the package body; and (4) a conductive layer disposed on the upper surface of the package body and the conductive via.