公开(公告)号：US20210225747A1

公开(公告)日：2021-07-22

申请号：US16749635

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Cheng Yuan CHEN ,  Chun Chen CHEN ,  Jiming LI ,  Chien-Wen TU

IPC: H01L23/498 ,  H01L23/66 ,  H01L21/48

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than −20 dB.

公开(公告)号：US20230298985A1

公开(公告)日：2023-09-21

申请号：US18201145

申请日：2023-05-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Cheng Yuan CHEN ,  Chun Chen CHEN ,  Jiming LI ,  Chien-Wen TU

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/66

CPC classification number: H01L23/49811 ,  H01L21/4889 ,  H01L23/66 ,  H01L2223/6605

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S 11 parameter of the connector is less than −20 dB.