公开(公告)号：US20200251421A1

公开(公告)日：2020-08-06

申请号：US16264599

申请日：2019-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chen Yuang CHEN ,  Jiming LI ,  Chun Chen CHEN ,  Yuanhao YU

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52

Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

公开(公告)号：US20210225747A1

公开(公告)日：2021-07-22

申请号：US16749635

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Cheng Yuan CHEN ,  Chun Chen CHEN ,  Jiming LI ,  Chien-Wen TU

IPC: H01L23/498 ,  H01L23/66 ,  H01L21/48

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than −20 dB.

公开(公告)号：US20230298985A1

公开(公告)日：2023-09-21

申请号：US18201145

申请日：2023-05-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Cheng Yuan CHEN ,  Chun Chen CHEN ,  Jiming LI ,  Chien-Wen TU

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/66

CPC classification number: H01L23/49811 ,  H01L21/4889 ,  H01L23/66 ,  H01L2223/6605

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S 11 parameter of the connector is less than −20 dB.

公开(公告)号：US20230145588A1

公开(公告)日：2023-05-11

申请号：US18095513

申请日：2023-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng Yuan CHEN ,  Jiming LI ,  Chun Chen CHEN ,  Yuanhao YU

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L21/4853 ,  H01L23/66 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/526 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/3025

Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.