公开(公告)号：US20190229054A1

公开(公告)日：2019-07-25

申请号：US15880377

申请日：2018-01-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU ,  Jen-Kuang FANG ,  Min Lung HUANG ,  Chan Wen LIU ,  Ching Kuo HSU

IPC: H01L23/522 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.

公开(公告)号：US20180174954A1

公开(公告)日：2018-06-21

申请号：US15387018

申请日：2016-12-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU ,  Ching Kuo HSU

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48

Abstract: A wiring structure includes a main body, a first dielectric layer, a first circuit layer and a second dielectric layer. The first dielectric layer is disposed on the main body, and defines a plurality of first grooves and at least one receiving portion between two first grooves. The first circuit layer is disposed on the first dielectric layer, and includes at least one first conductive trace disposed on the receiving portion. A width of the first conductive trace is less than a width of the receiving portion. A second dielectric layer disposed on the first dielectric layer, and extends into the first grooves.