公开(公告)号：US11973048B2

公开(公告)日：2024-04-30

申请号：US17521786

申请日：2021-11-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： An-Nong Wen ,  Ching-Han Huang ,  Ching-Ho Chang

IPC: H01L23/48 ,  B81B7/00 ,  B81C3/00 ,  H01L23/00

CPC classification number: H01L24/17 ,  B81B7/007 ,  B81C3/001 ,  H01L24/11 ,  H01L24/16 ,  B81B2207/012 ,  B81B2207/098 ,  B81C2203/035 ,  B81C2203/0792 ,  H01L2224/11462 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/17517 ,  H01L2924/1433 ,  H01L2924/1461

Abstract: A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.

公开(公告)号：US11171108B2

公开(公告)日：2021-11-09

申请号：US16592683

申请日：2019-10-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： An-Nong Wen ,  Ching-Han Huang ,  Ching-Ho Chang

IPC: H01L21/00 ,  H01L23/00 ,  B81B7/00 ,  B81C3/00

Abstract: A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.