公开(公告)号：US12183593B2

公开(公告)日：2024-12-31

申请号：US17332854

申请日：2021-05-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia-Pin Chen ,  Chia Sheng Tien ,  Wan-Ting Chiu ,  Chi Long Tsai ,  Cyuan-Hong Shih ,  Yen Liang Chen

IPC: H01L21/48 ,  H01L23/00 ,  H01L25/00

Abstract: A manufacturing method for manufacturing a package structure is provided. The manufacturing method includes: (a) providing a carrier having a top surface and a lateral side surface, wherein the top surface includes a main portion and a flat portion connecting the lateral side surface, and a first included angle between the main portion and the flat portion is less than a second included angle between the main portion and the lateral side surface; (b) forming an under layer on the carrier to at least partially expose the flat portion; and (c) forming a dielectric layer on the under layer and covering the exposed flat portion.