公开(公告)号：US10818517B2

公开(公告)日：2020-10-27

申请号：US16285002

申请日：2019-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Huang Han Chen ,  Ping-Feng Yang

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/78

Abstract: A method for manufacturing a semiconductor package structure includes providing a semiconductor chip, encapsulating the semiconductor chip via a package body, the package body having a first surface opposite to a second surface, and coating a first self-assembled monolayer (SAM) over the first surface and the second surface of the package body.