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1.发明申请公开(公告)号：US20210249371A1
公开(公告)日：2021-08-12
申请号：US16786590
申请日：2020-02-10
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jia-Zhe LEE , Tai-Hung KUO
IPC: H01L23/00 , B81C1/00 , B81B7/02 , C09J183/04 , C09J127/22
Abstract: A semiconductor device package includes a substrate, a lid, a MEMS device and a gel. The lid is disposed on the substrate and defines a cavity together with the substrate. The MEMS device is disposed in the cavity. The gel covers the MEMS component. The lid is attached to the substrate through a silicone-based adhesive.
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