公开(公告)号：US11217509B2

公开(公告)日：2022-01-04

申请号：US16749586

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jyun-Chi Jhan ,  Guo-Cheng Liao

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: Present disclosure provides a lead frame, including a die paddle and a plurality of leads surrounding the die paddle. Each of the leads including a finger portion proximal to the die paddle and a lead portion distal from the die paddle. The finger portion includes a main body and at least one support structure. The respective support structures on adjacent leads are mutually isolated, and a distance between the support structure and the die paddle is smaller than a distance between the lead portion and the die paddle. A semiconductor package structure including the lead frame described herein and a semiconductor package assembly including the semiconductor package structure described herein are also provided.