公开(公告)号：US20230317502A1

公开(公告)日：2023-10-05

申请号：US17711762

申请日：2022-04-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun Hung TSAI ,  Chenghan SHE ,  Kuo-Chih HUANG ,  Kuan-Lin YEH

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6838 ,  H01L21/67144 ,  H01L24/14

Abstract: A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic component with the suction device, wherein an edge of the at least one recess does not overlap the at least one conductive stud from a top view while moving the electronic component with the suction device.