公开(公告)号：US20220310576A1

公开(公告)日：2022-09-29

申请号：US17214550

申请日：2021-03-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Tsung CHEN ,  Li-Hua TAI ,  Paofa WANG

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/04 ,  H01L23/00 ,  H01L21/56

Abstract: The present disclosure provides a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a substrate, a first electronic component, an interlayer, a third electronic component and an encapsulant. The first electronic component is disposed on the substrate. The first electronic component has an upper surface and a lateral surface and a first edge between the upper surface and the lateral surface. The interlayer is on the upper surface of the first electronic component. The third electronic component is attached to the upper surface of the first electronic component via the interlayer. The encapsulant encapsulates the first electronic component and the interlayer. The interlayer does not contact the lateral surface of the first electronic component.

公开(公告)号：US20250105188A1

公开(公告)日：2025-03-27

申请号：US18371377

申请日：2023-09-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Paofa WANG ,  Huang Ming CHANG ,  Yung-Hsing CHANG ,  Yung-Chi CHEN ,  Hsiu-Hung SU

IPC: H01L23/00 ,  H01L23/498

Abstract: A package structure is provided. The package structure includes a substrate, a sensing device, a light transmissive member, and a bonding structure. The sensing device is over the substrate, and the light transmissive member is over the sensing device. The bonding structure has an upper surface connected to the light transmissive member and a lower surface connected to the sensing device. A width of the upper surface is less than a width of the lower surface of the bonding structure.