公开(公告)号：US20220310576A1

公开(公告)日：2022-09-29

申请号：US17214550

申请日：2021-03-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Tsung CHEN ,  Li-Hua TAI ,  Paofa WANG

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/04 ,  H01L23/00 ,  H01L21/56

Abstract: The present disclosure provides a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a substrate, a first electronic component, an interlayer, a third electronic component and an encapsulant. The first electronic component is disposed on the substrate. The first electronic component has an upper surface and a lateral surface and a first edge between the upper surface and the lateral surface. The interlayer is on the upper surface of the first electronic component. The third electronic component is attached to the upper surface of the first electronic component via the interlayer. The encapsulant encapsulates the first electronic component and the interlayer. The interlayer does not contact the lateral surface of the first electronic component.