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公开(公告)号：US20210257286A1
公开(公告)日：2021-08-19
申请号：US16793989
申请日：2020-02-18
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jaw-Ming DING , Ren-Hung CHOU , Yi-Hung LIN
IPC: H01L23/498 , H01L23/00 , H01L23/31 , H01L23/552
Abstract: A semiconductor package structure includes a substrate. The substrate includes a first ground layer. The first ground layer has a body and a first tooth protruding from a side of the body. The first tooth has a first lateral side. The first lateral side of the first tooth is inclined relative to the side of the body in a top view of the first ground layer.
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