公开(公告)号：US20200381338A1

公开(公告)日：2020-12-03

申请号：US16430260

申请日：2019-06-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tang-Yuan CHEN ,  Yuan Tzuo LUO ,  Shao-Cheng YEN ,  Meng-Kai SHIH ,  Chih-Pin HUNG

IPC: H01L23/433 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor device package includes a carrier, an electronic component, a package body and a ring structure. The electronic component is disposed on the carrier. The electronic component has a side surface. The package body is disposed on the carrier. The package body exposes at least a portion of the side surface of the electronic component. The ring structure is disposed on the package body and surrounds the portion of the side surface of the electronic component exposed from the package body.