公开(公告)号：US11756904B2

公开(公告)日：2023-09-12

申请号：US16895989

申请日：2020-06-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Cheng-Lin Ho ,  Yu-Lin Shih ,  Shih-Chun Li

IPC: H01L23/66 ,  H01Q1/22

CPC classification number: H01L23/66 ,  H01Q1/2283 ,  H01L2223/6616 ,  H01L2223/6677

Abstract: A semiconductor device package includes a substrate, a reflector, a radiator and a first director. The reflector is disposed on a surface of the substrate. The radiator is disposed over the reflector. The first director is disposed over the radiator. The reflector, the radiator and the first director have different elevations with respect to the surface of the substrate. The radiator and the first director define an antenna.