公开(公告)号：US20190393126A1

公开(公告)日：2019-12-26

申请号：US16262762

申请日：2019-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shiu-Fang YEN ,  Chang-Lin YEH ,  Jen-Chieh KAO

IPC: H01L23/367 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/38

Abstract: A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.

公开(公告)号：US20230026633A1

公开(公告)日：2023-01-26

申请号：US17959925

申请日：2022-10-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shiu-Fang YEN ,  Chang-Lin YEH ,  Jen-Chieh KAO

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/38 ,  H01L25/065

Abstract: A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.