公开(公告)号：US11862585B2

公开(公告)日：2024-01-02

申请号：US16798164

申请日：2020-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Syu-Tang Liu ,  Huang-Hsien Chang ,  Shu-Han Yang

IPC: H01L23/00 ,  H01L23/28 ,  H01L23/495 ,  H01L23/485 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L24/02 ,  H01L23/28 ,  H01L23/485 ,  H01L23/49503 ,  H01L23/5385 ,  H01L25/0655

Abstract: A semiconductor package structure includes a first substrate, a second substrate, a pad layer and a conductive bonding layer. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The second substrate is disposed side-by-side with the first substrate. The pad layer is disposed on the second surface of the first substrate and the second surface of the second substrate. The conductive bonding layer is disposed between the pad layer and the second surfaces of the first substrate and the second substrate.