公开(公告)号：US20230216174A1

公开(公告)日：2023-07-06

申请号：US17566573

申请日：2021-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung Ju YU ,  Shao-Lun YANG ,  Chun-Hung YEH ,  Hong Jie CHEN ,  Tsung-Wei LU ,  Wei Shuen KAO

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L23/3128 ,  H01L21/561 ,  H01L2223/6677 ,  H01Q13/18

Abstract: An electronic package and a method of manufacturing an electronic package are provided. The electronic package includes a carrier, an antenna substrate, and an electronic component. The carrier has a first surface and a second surface. The antenna substrate includes a resonant cavity and is disposed over the first surface. The antenna substrate is closer to the first surface than the second surface of the carrier. The electronic component is disposed between the antenna substrate and the second surface of the carrier.