公开(公告)号：US20230216174A1

公开(公告)日：2023-07-06

申请号：US17566573

申请日：2021-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung Ju YU ,  Shao-Lun YANG ,  Chun-Hung YEH ,  Hong Jie CHEN ,  Tsung-Wei LU ,  Wei Shuen KAO

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L23/3128 ,  H01L21/561 ,  H01L2223/6677 ,  H01Q13/18

Abstract: An electronic package and a method of manufacturing an electronic package are provided. The electronic package includes a carrier, an antenna substrate, and an electronic component. The carrier has a first surface and a second surface. The antenna substrate includes a resonant cavity and is disposed over the first surface. The antenna substrate is closer to the first surface than the second surface of the carrier. The electronic component is disposed between the antenna substrate and the second surface of the carrier.

公开(公告)号：US20220301995A1

公开(公告)日：2022-09-22

申请号：US17209085

申请日：2021-03-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Chih CHO ,  Chun-Hung YEH ,  Tsung-Wei LU

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: At least some embodiments of the present disclosure relate to a semiconductor package structure. The semiconductor package structure includes a substrate with a first surface, an encapsulant, an electronic component, and a patterned conductive layer. The encapsulant is disposed on the first surface of the substrate. The encapsulant includes a first surface and a second surface. The patterned conductive layer extends on the first surface and the second surface of the encapsulant and protrudes from the first surface and the second surface of the encapsulant. The electronic component is disposed on the patterned conductive layer.

公开(公告)号：US20220246533A1

公开(公告)日：2022-08-04

申请号：US17163213

申请日：2021-01-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Chih CHO ,  Shao-Lun Yang ,  Chun-Hung YEH ,  Tsung-Wei LU

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: The present disclosure provides a semiconductor device package and a method of manufacturing the same. The semiconductor device package includes a substrate, an interconnection structure, a package body, and a first electronic component. The interconnection structure is disposed on the substrate. The package body is disposed on the substrate and partially covers the interconnection structure. The package body has a position limiting structure around the interconnection structure. The first electronic component is disposed on the interconnection structure and electrically connected to the interconnection structure.