公开(公告)号：US12027467B2

公开(公告)日：2024-07-02

申请号：US17163213

申请日：2021-01-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Chih Cho ,  Shao-Lun Yang ,  Chun-Hung Yeh ,  Tsung-Wei Lu

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5386

Abstract: The present disclosure provides a semiconductor device package and a method of manufacturing the same. The semiconductor device package includes a substrate, an interconnection structure, a package body, and a first electronic component. The interconnection structure is disposed on the substrate. The package body is disposed on the substrate and partially covers the interconnection structure. The package body has a position limiting structure around the interconnection structure. The first electronic component is disposed on the interconnection structure and electrically connected to the interconnection structure.

公开(公告)号：US11908781B2

公开(公告)日：2024-02-20

申请号：US17209085

申请日：2021-03-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Chih Cho ,  Chun-Hung Yeh ,  Tsung-Wei Lu

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/49805 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49838

Abstract: At least some embodiments of the present disclosure relate to a semiconductor package structure. The semiconductor package structure includes a substrate with a first surface, an encapsulant, an electronic component, and a patterned conductive layer. The encapsulant is disposed on the first surface of the substrate. The encapsulant includes a first surface and a second surface. The patterned conductive layer extends on the first surface and the second surface of the encapsulant and protrudes from the first surface and the second surface of the encapsulant. The electronic component is disposed on the patterned conductive layer.