公开(公告)号：US20240170364A1

公开(公告)日：2024-05-23

申请号：US17993797

申请日：2022-11-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hung-Hsien HUANG ,  Wen Chun WU ,  Chih-Pin HUNG

IPC: H01L23/427 ,  H01L23/00

CPC classification number: H01L23/427 ,  H01L24/32 ,  H01L23/3736 ,  H01L2224/32245

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat source and the electronic component. The heat dissipation element includes a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component.