公开(公告)号：US20220384208A1

公开(公告)日：2022-12-01

申请号：US17332854

申请日：2021-05-27

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chia-Pin CHEN ,  Chia Sheng TIEN ,  Wan-Ting CHIU ,  Chi Long TSAI ,  Cyuan-Hong SHIH ,  Yen Liang CHEN

IPC分类号： H01L21/48 ,  H01L23/00 ,  H01L25/00

摘要： A manufacturing method for manufacturing a package structure is provided. The manufacturing method includes: (a) providing a carrier having a top surface and a lateral side surface, wherein the top surface includes a main portion and a flat portion connecting the lateral side surface, and a first included angle between the main portion and the flat portion is less than a second included angle between the main portion and the lateral side surface; (b) forming an under layer on the carrier to at least partially expose the flat portion; and (c) forming a dielectric layer on the under layer and covering the exposed flat portion.