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公开(公告)号：US20220399250A1
公开(公告)日：2022-12-15
申请号：US17344842
申请日：2021-06-10
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Yi-Chi CHEN , Ming-Han WANG
IPC: H01L23/48 , H01L27/146 , H01L23/00
Abstract: A semiconductor package includes a first die. The first die includes a semiconductor substrate. The semiconductor substrate has a first surface, a second surface opposite to the first surface, and a through hole between the first surface and the second surface and having an inner wall. The inner wall has a first lever arm. A length of the first lever arm is less than a thickness of the semiconductor substrate.
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